Image module package with transparent sub-assembly

ABSTRACT

There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.

BACKGROUND

1. Field of the Disclosure

This disclosure generally relates to an image module package and, moreparticularly, to an image module package and a manufacturing methodthereof with a sub-assembly made by an over-molding process or a castingprocess.

2. Description of the Related Art

Light sensor modules, such as proximity sensors, ambient light sensorsand color sensors generally detect light energy of a predeterminedspectrum and output detected signals for post-processing by a processor.

In order to detect the predetermined spectrum, an organic or aninorganic filtering layer can be directly coated on a sensing surface ofthe photo sensor chip thereof, or a glass filter can be attached to thesensing surface.

For example, FIG. 1 is a solid diagram of the conventional light sensormodule which includes a substrate 90. A photo sensor chip 91 and a lightsource 92 are disposed on the substrate 90, wherein the light source 92is configured to illuminate an approaching object (not shown) and thephoto sensor chip 91 is configured to detect reflected light from theapproaching object. In order to allow the photo sensor chip 91 to have agood response to the spectrum of light emitted by the light source 92, aglass filter 93 is directly disposed on a pixel array of the photosensor chip 91 so as to block ambient light.

However, inventors note that if the glass filter 93 is directly disposedon the sensing surface, the sensing surface can be damaged. Furthermore,the disposing of the glass filter 93 further has the alignment problem.

SUMMARY

Accordingly, the present disclosure provides an image module package anda manufacturing method thereof that incorporate an over-molding processor a casting process in the manufacturing process.

The present disclosure provides an image module package and amanufacturing method thereof that may simplify the manufacturing processand eliminate the mechanical damage to a sensing surface thereof.

The present disclosure further provides an image module package and amanufacturing method thereof that may improve the illuminationefficiency of the light emitting die through a sub-assembly made by theover-molding process or casting process.

The present disclosure provides an image module package including asubstrate, a photo sensor chip, a first molded transparent layer and aglass filter. The substrate has an upper surface. The photo sensor chipis disposed on the upper surface of the substrate and electricallyconnected to the substrate. The first molded transparent layer coversthe photo sensor chip and a part of the upper surface of the substrate,wherein a top surface of the first molded transparent layer is formedwith a receptacle opposite to the photo sensor chip. The glass filter isaccommodated in the receptacle.

The present disclosure further provides a manufacturing method of animage module package including the steps of: attaching a photo sensorchip and a light emitting die to a printed circuit board; molding atransparent layer on the photo sensor chip and the light emitting die,wherein a top surface of the molded transparent layer is formed with areceptacle opposite to the photo sensor chip; and disposing a glassfilter in the receptacle.

The present disclosure further provides a manufacturing method of animage module package including the steps of: attaching a photo sensorchip and a light emitting die to a printed circuit board; molding afirst transparent layer on the photo sensor chip, wherein a top surfaceof the first molded transparent layer is formed with a receptacleopposite to the photo sensor chip; molding a second transparent layer onthe light emitting die; and disposing a glass filter in the receptacle.

BRIEF DESCRIPTION OF THE DRAWINGS

Other objects, advantages, and novel features of the present disclosurewill become more apparent from the following detailed description whentaken in conjunction with the accompanying drawings.

FIG. 1 is a solid diagram of the conventional light sensor module.

FIG. 2 is a cross-sectional view of the image module package accordingto one embodiment of the present disclosure.

FIGS. 3A-3E are solid diagrams of the manufacturing process of the imagemodule package according to one embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENT

It should be noted that, wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.

Referring to FIG. 2, it is a cross-sectional view of the image modulepackage 2 according to one embodiment of the present disclosure. Theimage module package 2 includes a substrate 20, a photo sensor chip 21,a light emitting die 22, a first molded transparent layer 231, a secondmolded transparent layer 232, a glass filter 24 and an opaque layer 25.In the image module package 2, the light emitting die 22 is configuredto illuminate an object (not shown) and the photo sensor chip 21 isconfigured to receive reflected light from the object and convert thereflected light to electrical signals, wherein the object is, forexample, a finger. In one embodiment, the photo sensor chip 21 directlyperforms the post-processing according to the converted electricalsignals, e.g. calculating the object distance or ambient lightintensity. In some embodiments, the photo sensor chip 21 transmits theconverted electrical signals to an external processor forpost-processing through the substrate 20.

The substrate 20 is, for example, a chip on board printed circuit board(COB PCB) which has the advantage of reducing failure due to warping ofthe chip on board package, but the present disclosure is not limitedthereto as long as the substrate 20 is a suitable printed circuit board.The substrate 20 has an upper surface for disposing elements.

The photo sensor chip 21 is disposed on the upper surface of thesubstrate 20 and electrically connected to the substrate 20, wherein thephoto sensor chip 21 is wire bonded to the substrate 20, but not limitedthereto and any known chip bonding method may be used. The photo sensorchip 21 includes a pixel array 211 configured to convert light energy toelectrical signals, and the pixel array 211 is consisted of, forexample, a plurality of photodiodes arranged in a matrix. The pixelarray 211 is formed on a sensing surface of the photo sensor chip 21.

The light emitting die 22 is, for example, a light emitting diode die(LED die) or a laser diode die which is disposed on the upper surface ofthe substrate 20 and electrically connected to the substrate 20, whereinthe light emitting die 22 is wire bonded to the substrate 20, but notlimited thereto and any known die bonding method may be used. The lightemitting die 22 emits light of a wavelength of about 940 nm, but notlimited thereto and other invisible light may be used.

The first molded transparent layer 231 covers the photo sensor chip 21and a part of the upper surface of the substrate 20 through anover-molding process or a casting process. In one embodiment, a topsurface of the first molded transparent layer 231 is a flat surface thatis substantially parallel to the upper surface of the substrate 20. Thetop surface of the first molded transparent layer 231 is formed with areceptacle 2312 opposite to the photo sensor chip 21 configured toaccommodate the glass filter 24. It should be mentioned that althoughFIG. 2 shows that the receptacle 2312 is a rectangular shape, but thepresent disclosure is not limited thereto. The shape of the receptacle2312 is determined according to a shape of the glass filter 24. Forexample, when the glass filter 24 is a circular plate, the receptacle2312 has a circular shape, and the depth thereof is determined accordingto the glass filter 24 to be accommodated. Preferably, an area of thereceptacle 2312 is at least larger than that of the pixel array 211.

In one embodiment, a transmitting spectrum of the glass filter 24 isbetween 920 nm and 960 nm, but not limited thereto. The transmittingspectrum of the glass filter 24 is determined according to an emissionspectrum of the light emitting die 22. The glass filter 24 is secured inthe receptacle 2312 through, for example, the transparent adhesive.

The second molded transparent layer 232 covers the light emitting die 22and a part of the upper surface of the substrate 20 through theover-molding process or casting process. In one embodiment, in order toimprove the illumination efficiency of the light emitting die 22, a topsurface of the second molded transparent layer 232 is formed with alight guiding structure 2322 opposite to the light emitting die 22,wherein the light guiding structure 2322 has a curved surface, e.g. aconvex dome or a concave depression, and integrally formed with thesecond molded transparent layer 232.

In addition, in order to avoid the light emitted by the light emittingdie 22 directly being received by the photo sensor chip 21 through themolded transparent layer, the first molded transparent layer 231 and thesecond molded transparent layer 232 are separated from each other, e.g.separately formed during manufacturing, or simultaneously formed andthen cut into two parts

In some embodiments, in order to prevent ambient light from beingreceived by the photo sensor chip 21 to cause the interference, theimage module package 2 further includes an opaque layer 25 covering thefirst molded transparent layer 231 and the second molded transparentlayer 232, and the opaque layer 25 includes two through holes 251 and252 at a top surface thereof and respectively opposite to the receptacle2312 (or the glass filter 24) and the light guiding structure 2322 (orthe light emitting die 22). In one embodiment, the opaque layer 25 is acover which is formed separately and covered on the first moldedtransparent layer 231 and the second molded transparent layer 232 whenthe image module package 2 is manufactured. In another embodiment, theopaque layer 25 is a molded light blocking layer which is coved on thefirst molded transparent layer 231 and the second molded transparentlayer 232 through the over-molding process or casting process. Asmentioned above, in order to further prevent the light emitted from thelight emitting die 22 from propagating to the photo sensor chip 21, theopaque layer 25 extends to the upper surface of the substrate 20 througha groove between the photo sensor chip 21 and the light emitting die 22.

Referring to FIGS. 3A-3E, they are solid diagrams of the manufacturingprocess of the image module package according to one embodiment of thepresent disclosure, and details thereof are described hereinafter.

Referring to FIG. 3A, after the printed circuit board 20 is cleaned, aphoto sensor chip 21 and a light emitting die 22 are attached to anupper surface of the printed circuit board 20. Next, the photo sensorchip 21 and the light emitting die 22 are electrically connected to theprinted circuit board 20, e.g. through wire bonding, but not limitedthereto. Other known bonding methods may be used.

Referring to FIG. 3B, a transparent layer 23 is molded on the photosensor chip 21 and the light emitting die 22, in some embodimentscovering a part of the upper surface of the substrate 20, by theover-molding process or casting process, wherein a top surface of thetransparent layer 23 is formed with a receptacle 2312 in the moldingprocess opposite to the photo sensor chip 21. The receptacle 2312 is foraccommodating a glass filter and thus a shape of the receptacle 2312 isdetermined according to that of the glass filter and is not limited tothat shown in FIG. 3B.

It is appreciated that said molding process is implemented by the stepsof: covering a mold on the substrate 20 and accommodating the photosensor chip 21 and the light emitting die 22 in the cavity of the mold;injecting fluid material into the cavity; and removing the mold to leavethe molded transparent layer 23 covering the photo sensor chip 21 andthe light emitting die 22 after the fluid material is cured, wherein theshape of the cavity is previously determined according to the shape ofthe transparent layer 23 to be made.

In some embodiments, a top surface of the transparent layer 23 isfurther formed with a light guiding structure 2322, which is a convex orconcave surface, opposite to the light emitting die 22 for improving theillumination efficiency. In some embodiments, when the light emittingdie 22 has a good light emission pattern, the light guiding structure2322 may not be implemented.

Referring to FIG. 3C, a diamond blade is then used to cut between thephoto sensor chip 21 and the light emitting die 22 so as to divide thetransparent layer 23 into two parts, e.g. a first transparent layer 231and a second transparent layer 232. In this manner, the light emittedfrom the light emitting die 22 is not received by the photo sensor chip21 directly through the transparent layer 23 to cause the interference.

In another embodiment, the first transparent layer 231 and the secondtransparent layer 232 are respectively formed on the printed circuitboard 20 through the over-molding process or casting process. In thisembodiment, a first transparent layer 231 is molded on the photo sensorchip 21 and covering a part of the upper surface of the substrate 20,wherein a top surface of the first transparent layer 231 is also formedwith a receptacle 2312 opposite to the photo sensor chip 21; and asecond transparent layer 232 is molded on the light emitting die 22 andcovering a part of the upper surface of the substrate 20, wherein a topsurface of the second transparent layer 232 is optionally formed with alight guiding structure 2322. Accordingly, this embodiment does notinclude the step of FIG. 3B, i.e. the transparent layer 23 not beingcut.

In other words, in the embodiment of the present disclosure the firsttransparent layer 231 and the second transparent layer 232 are formedsimultaneously or sequentially and separated from each other.

Referring to FIG. 3D, next a glass filter 24 is disposed in thereceptacle 2312 and secured in the receptacle 2312 through thetransparent adhesive. As the receptacle 2312 is aligned with the photosensor chip 21 when it is formed, the alignment procedure isaccomplished at the same time when the glass filter 24 is accommodatedin the receptacle 2312.

Referring to FIG. 3E, finally an opaque layer 25, e.g. an opaque coveror a light blocking layer molded through the over-molding process orcasting process, is covered outside of the transparent layer 23 (or thefirst transparent layer 231 and the second transparent layer 232). Theopaque layer 25 includes two through holes 251 and 252 respectivelyopposite to the photo sensor chip 21 and the light emitting die 22 toallow the module light to eject via the through hole 252 and allow thereflected light to enter the image module package 20 via the throughhole 251.

In addition, in the above processes when the adhesive is used, e.g. dieattachment and disposition of the glass filter, a curing process isfurther included.

It should be mentioned that although the above embodiments show only oneimage module package being formed on a printed circuit board 20, thepresent disclosure is not limited thereto. In actual manufacturing, aplurality of image module packages may be formed on one printed circuitboard 20 simultaneously, and after the step shown in FIG. 3E isaccomplished, the image module packages are then singulated by a cuttingprocess.

It should be mentioned that although in the above embodiments the imagemodule package includes both the photo sensor chip 21 and the lightemitting die 22, the present disclosure is not limited thereto.According to different applications, the image module package 2 includesonly the photo sensor chip 21 but does not include the light emittingdie 22. For example, in an image system including an external lightsource, the image module package 2 may not include the light emittingdie 22, and in this embodiment only the descriptions regarding the lightemitting die 22, the second molded transparent layer 232 and the opaquelayer outside the second molded transparent layer 232 in the aboveembodiment are ignored, but other parts are the same.

As mentioned above, in the conventional light sensor package because theglass filter is directly disposed on the pixel array of the photo sensorchip, it has the problem that the photo sensor chip can be damaged andthe alignment of the glass filter is not easy. Therefore, the presentdisclosure further provides an image module package (FIG. 2) and amanufacturing method thereof (FIGS. 3A-3E) that form a transparentsub-assembly (i.e. transparent layer) directly on the photo sensor chipby means of the over-molding process or casting process such that aglass filter is not directly disposed on the photo sensor chip, whereinthe transparent sub-assembly is directly formed with a receptacle inmanufacturing so as to simplify the disposition of the glass filter. Inaddition, a light guiding structure is optionally formed on thetransparent sub-assembly so as to improve the operating performance ofthe image module package.

Although the disclosure has been explained in relation to its preferredembodiment, it is not used to limit the disclosure. It is to beunderstood that many other possible modifications and variations can bemade by those skilled in the art without departing from the spirit andscope of the disclosure as hereinafter claimed.

What is claimed is:
 1. An image module package, comprising: a substratecomprising an upper surface; a photo sensor chip disposed on the uppersurface of the substrate and electrically connected to the substrate; afirst molded transparent layer covering the photo sensor chip and a partof the upper surface of the substrate, wherein a top surface of thefirst molded transparent layer is formed with a receptacle opposite tothe photo sensor chip; an opaque layer covering the first moldedtransparent layer and having a through hole opposite to the receptacle;and a glass filter accommodated in the receptacle, wherein the throughhole is smaller than a size of the glass filter such that a part of asurface of the glass filter is directly contacted with and covered bythe opaque layer in a thickness direction of the substrate.
 2. The imagemodule package as claimed in claim 1, further comprising a lightemitting die disposed on the upper surface of the substrate andelectrically connected to the substrate.
 3. The image module package asclaimed in claim 2, further comprising a second molded transparent layercovering the light emitting die and a part of the upper surface of thesubstrate.
 4. The image module package as claimed in claim 3, whereinthe first molded transparent layer and the second molded transparentlayer are separated from each other.
 5. The image module package asclaimed in claim 3, wherein a top surface of the second moldedtransparent layer is formed with a light guiding structure opposite tothe light emitting die.
 6. The image module package as claimed in claim5, wherein the opaque layer covers the first molded transparent layerand the second molded transparent layer, and the opaque layer hasanother through hole opposite to the light guiding structure.
 7. Theimage module package as claimed in claim 6, wherein the opaque layer isa cover or a molded light blocking layer.
 8. The image module package asclaimed in claim 1, wherein the opaque layer is a cover or a moldedlight blocking layer.
 9. The image module package as claimed in claim 1,wherein a shape of the receptacle is a circular shape or a rectangularshape, a top surface of the glass filter is a flat surface, and atransmitting spectrum of the glass filter is between 920 nm and 960 nm.10. The image module package as claimed in claim 1, wherein the photosensor chip comprises a pixel array arranged under the glass filter. 11.The image module package as claimed in claim 5, wherein the lightguiding structure is integrally formed with the second moldedtransparent layer.
 12. The image module package as claimed in claim 6,wherein the light guiding structure is a convex dome and accommodated inthe another through hole.
 13. An image module package, comprising: asubstrate comprising an upper surface; a photo sensor chip disposed onthe upper surface of the substrate and electrically connected to thesubstrate; a first molded transparent layer covering the photo sensorchip and a part of the upper surface of the substrate, wherein a topsurface of the first molded transparent layer is formed with areceptacle opposite to the photo sensor chip; a light emitting diedisposed on the upper surface of the substrate and electricallyconnected to the substrate; a second molded transparent layer coveringthe light emitting die and a part of the upper surface of the substrate,wherein a top surface of the second molded transparent layer is formedwith a light guiding structure opposite to the light emitting die; anopaque layer covering the first molded transparent layer and the secondmolded transparent layer; and a glass filter accommodated in thereceptacle, wherein a part of a surface of the glass filter isoverlapped and directly contacted with the opaque layer in a thicknessdirection of the substrate.
 14. The image module package as claimed inclaim 13, wherein the first molded transparent layer and the secondmolded transparent layer are separated from each other.
 15. The imagemodule package as claimed in claim 13, wherein the opaque layer has twothrough holes respectively opposite to the receptacle and the lightguiding structure, and the opaque layer separates the first moldedtransparent layer and the second molded transparent layer from eachother.
 16. The image module package as claimed in claim 15, wherein theopaque layer is a cover or a molded light blocking layer.
 17. The imagemodule package as claimed in claim 15, wherein the light guidingstructure is a convex dome and accommodated in the through hole oppositethereto.
 18. The image module package as claimed in claim 13, wherein ashape of the receptacle is a circular shape or a rectangular shape, atop surface of the glass filter is a flat surface, and a transmittingspectrum of the glass filter is between 920 nm and 960 nm.
 19. The imagemodule package as claimed in claim 13, wherein the photo sensor chipcomprises a pixel array arranged under the glass filter.
 20. The imagemodule package as claimed in claim 13, wherein the light guidingstructure is integrally formed with the second molded transparent layer.21. An image module package, comprising: a substrate comprising an uppersurface; a photo sensor chip disposed on the upper surface of thesubstrate and electrically connected to the substrate; a moldedtransparent layer covering the photo sensor chip and a part of the uppersurface of the substrate, wherein a top surface of the moldedtransparent layer is formed with a receptacle opposite to the photosensor chip; an opaque layer covering the molded transparent layer andhaving a through hole opposite to the receptacle; and a glass filteraccommodated in the receptacle, wherein a depth of the receptacle isidentical to a thickness of the glass filter, and the glass filter fullyfits in the receptacle, and the through hole is smaller than a size ofthe receptacle such that a part of the opaque layer is overlapped withthe receptacle in a thickness direction of the substrate and directlycontacted with the glass filter.